Solder Wire, Solder Bar, Solder Paste Manufacturer
JF-H832 hot melt glue is a one-component reactive polyurethane hot melt adhesive. This reactive hot melt adhesive is solid at room temperature. After heating, it will cool for immediate handling. Upon further exposure to ambient humidity, JF-H832 hot melt glue will achieve a high strength bond and excellent environmental resistance.
Features- High bonding strength
- Suitable for bonding metals and plastics
- Low service temperature (100°C- 130°C)
- Excellent heat and solvent resistance
- Excellent resistance to high and low temperatures
Applications
Bonding of components for branded cell phones, smartphones, tablets, wearable devices and other electronic devices
- Color: Black solid
- Solid content: 100%
- Specific gravity @ 25°C: 1.1
- Viscosity (10rpm): @ 120°C 6000±1500mPa•s
- Open time (glue line of 1mm): 5-10 minutes
- Application temperature: 100°C-130°C
- Thermal expansion coefficient: 170.2pm/ (mK)
- Thermal conductivity: 0.28W/ (mK)
- Specific heat: 2.80kj/ (kg.K)
- Elongation at break: > 500%
- Tensile strength: > 8.0MPa
- Tensile shear strength: > 8.0 MPa
Instructions
For optimal results, make sure that the parts are dry, clean, and free of grease and oil. However, good bonding can still be achieved on parts that are "as received" or slightly oily. The substrate's temperature shouldn't be any lower than 20°C. Low temperature will shorten the open time and cause the bonding failure. Pre-heating the substrate is advised if necessary. Dispense bead of product onto substrate. Within the suggested open time, mate with the opposing substrate. Allow for handling strength to be achieved.
Storage
Optimal storage conditions are between 15°C to 30°C and stored in original sealed foil bag. Storage outside this temperature range can adversely affect product properties and may reduce the stated shelf life.
