Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder spheres are suitable for BGA (ball grid array), CSP (chip scale packages), semi-conductor packaging, SMT rework repair, etc.
Specifications- Main elemental composition: Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5;
- Alloy density: 7.4g/cm3 ( 20℃);
- Solidus and liquidus temperatures: 217℃~219℃;
- Temperature: 300℃ 10℃/-0℃; Anti-oxidation time: 30min 5min/-0min;
- The liquid tin always remain silvery-white;
- Features: Phosphorus free, good solderability and high resistance to oxidation;
Silvery-white, smooth surface, no impurity, low color difference for each batch (△E<0.3), fully spherical in shape;
Size and Tolerances (Unit: μm)Diameter | Tolerance | Diameter | Tolerance |
≥500 | ±20 | <500 | ±10 |
Diameter | Sphericity(%) | Diameter | Sphericity(%) | Diameter | Sphericity(%) |
100~150 | ≧80 | 351~550 | ≧92 | 651~760 | ≧94 |
151~350 | ≧90 | 551~650 | ≧93 | 761~1000 | ≧95 |
Diameter | Oxygen Content (%) | Diameter | Oxygen Content (%) |
≦300 | ≦0.0026 | >300 | ≦0.0015 |
Anti-oxidation test
Reflow soldering test
High temperature and humidity test
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