Solder Wire, Solder Bar, Solder Paste Manufacturer

Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder Wire, Solder Bar, Solder Paste Manufacturer
Solder Wire, Solder Bar, Solder Paste Manufacturer

Solder spheres are suitable for BGA (ball grid array), CSP (chip scale packages), semi-conductor packaging, SMT rework repair, etc.

Specifications
  • Main elemental composition: Tin (Sn) 96.5, silver (Ag) 3.0, copper (Cu) 0.5;
  • Alloy density: 7.4g/cm3 ( 20℃);
  • Solidus and liquidus temperatures: 217℃~219℃;
  • Temperature: 300℃ 10℃/-0℃; Anti-oxidation time: 30min 5min/-0min;
  • The liquid tin always remain silvery-white;
  • Features: Phosphorus free, good solderability and high resistance to oxidation;
Product Appearance

Silvery-white, smooth surface, no impurity, low color difference for each batch (△E<0.3), fully spherical in shape;

Size and Tolerances (Unit: μm)
Diameter Tolerance Diameter Tolerance
≥500 ±20 <500 ±10
Roundness (Unit: μm)
Diameter Sphericity(%) Diameter Sphericity(%) Diameter Sphericity(%)
100~150 ≧80 351~550 ≧92 651~760 ≧94
151~350 ≧90 551~650 ≧93 761~1000 ≧95
Oxygen Content
Diameter Oxygen Content (%) Diameter Oxygen Content (%)
≦300 ≦0.0026 >300 ≦0.0015
Tests

Anti-oxidation test
Reflow soldering test
High temperature and humidity test

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