Wafer Book Cutter
Serving as a crucial unit in our wafer production line, the wafer book cutter is mainly used to cut laminated wafer biscuits into desired sizes. The wafer cutter is an automatic food cutting machine that starts by cutting the wafers with blades and then with steel wire.
Specifications of Wafer Book Cutter
Material: The frame of this food processing machinery is made of GB bars
PLC: Siemens
Switches: Schneider
- First cutting-blade
- Second cutting-steel wire
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