UV Laser Marking Machine

UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine
UV Laser Marking Machine

This UV laser marking machine uses 355nm high-energy UV photons to damage molecular bond at the surface layer of materials. It is a “cold” photo-ablation process and suitable for the applications where heat affected zones are not allowed, for example, marking circuit boards or chips.

Due to metal materials have a strong ability to absorb ultraviolet ray than infrared ray, this UV laser marking machine is more suitable for metal materials. It also can mark glass with a reduced risk of microfracture.

Features
  • UV laser belongs to cold light that can minimize the heat affected zones and prevent materials charring, so it is suitable for the applications where heat affected zones are not allowed.
  • The minimum focusing speckle of this UV laser is 15μm, it is suitable for micropore application and micro-drilling processing.
  • There are 3W, 5W,10W layers, various platforms and fixtures, they can be choose according to the workpieces you processed.
  • Controlling software can automatically layout text, picture, bar code, serial number, QR code, and compatibility with common software such as AutoCAD, CorelDRAW, Photoshop, that provides great convenience.
  • Supporting flight marking and rotary marking, effective increase your production efficiency.
Application

UV laser marking machine is designed for hyperfine marking and engraving. It is suitable for a wide scope of applications including marking polymer materials, LCD glass substrates, glassware, electronic components, communication equipment, car parts, precision instrument, tobaccos, animal identification labels, etc. It also can be used in some special applications such as forming micro-holes and blind holes on silicon wafer, removing metal surface coating.

Technical Parameters
Model ET- UV3 / ET-UV5 / ET-UV10
Laser type UV source
Laser power(W) 3W(5W,10W optional)
Wave length 355nm
Marking scope(mm) 50x50,100*100, 200*200mm
Marking speed ≤8000mm
Minimum character 0.12mm
Minimum line width 0.01mm
Marking depth ≤0.5MM
Repeat position accuracy ±0.001MM
Cooling type Water cooling
Acceptable graphic format PLT, DST, AI, DXF, BMP, JPG, CAD, CDR, DWG
Operating voltage AC 110/220V±10%, 50/60Hz
Operating temperature range 10-35 ℃
Operating humidity < 75%(Non-condensing)
Machine power < 1000W
Dimension 1100*800*1650mm
Weight 200kg
Laser safety classification Class 4
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