Ceramic Grinding Application

Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application
Ceramic Grinding Application

Ceramics encompass a wide array of materials, including super-hard ceramics, high toughness ceramics, semi-conductive ceramics, magnetic ceramics, and transparent ceramics. With such a diverse array of types, they are used in an equally diverse array of applications, including machinery, chemicals, electronics, optics, aviation, military and more.

Main methods for ceramic material performance improvement:
  • grinding the ceramic material into particles as fine as possible
  • controlling the ceramic particle size distribution to ensure performance won’t be affected by particles that are too wide
  • increasing particle dispersion as much as possible

Because applications are significantly impacted by the grinding quality, ceramic materials must be fully ground before use. Our grinding mills meet all the challenges posed by a ceramic ultra-high hardness and ultra-high wear resistance, ensuring a top of the line final quality.

Shown here are the results from ultrafine grinding of different ceramic materials using our grinding machines. The particle sizes of these ceramic powders has been significantly reduced and distribution is exceptionally more uniform after grinding.

Grinding of silicon nitride (Si3N4)
  • Before grinding
    1. After grinding
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 0.8 0.10
D90(μm) 2.1 0.15
Grinding of hexagonal boron nitride (h-BN)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 2.5 0.15
D90(μm) 3.5 0.28
Grinding of silicon carbide (SiC)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 8.5 0.032
D90(μm) 12 0.052
Grinding of boron carbide (B4C)
    1. Before grinding
    1. After grinding
    1. Before grinding
    1. After grinding
Grinding time 0h 3h 12h
D50(μm) 7.7 0.48 0.035
D90(μm) 14.8 0.66 0.053
Grinding of zirconia (ZrO2)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 1.2 0.05
D90(μm) 2.0 0.07
Grinding of zirconium silicate (ZrSiO4)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 0.8 0.10
D90(μm) 2.3 0.20
Grinding of strontium titanate (SrTiO3)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 2.88 0.050
D90(μm) 8.01 0.129
Grinding of barium carbonate (BaCO3)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50(μm) 9.35 0.097
D90(μm) 19.50 0.198
Grinding of α-aluminum (α-Al2O3)
    1. Before grinding
    1. After grinding
Characterized size Feed Products
D50 1.2μm 43nm
D90 2.1μm 71nm
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