Precision BGA Rework System

Precision BGA Rework System

 

Features
1. No need of nozzles, no airflow during re-flow process.
2. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
3. By reflecting foil to reduce thermal transmission to adjacent components.
4. Camera of BGA Rework System can be used to monitor the re-flow process.
5. No airflow during the process of BGA re-balling, and the success ratio of BGA re-balling can almost be up to 100%.

Specifications
IR Infrared Rework System

ModelIR2005
General power1600Watt(max)
Power of bottom heater 400W*2=800Watt(Dark infrared heating plate)
Power of top heater 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm)
Size of top heater60*60mm
Size of bottom heater135*250mm
Range of top heater 20-60mm(X, Y direction both adjustable)
Vacuum pump 12V/300mA, 0.05Mpa(max)
Top cooling fan12V/300mA, 15CFM
Laser alignment tube3V/30mA
Movable motor24V DC/100mA
Movable arm range93mm
Max PCB size300mm*300mm
LCD window65.7*23.5mm 16*2 characters
Soldering stationIntelligent digital lead free soldering station
Soldering power60Watt
Communication RS-232C(connect with PC)
Infrared temperature sensor0-300℃(Testing range)
External K-type sensorOptional
WeightAbout 13kg

PL Precision Placement System of BGA Rework System

ModelPL2005
PowerAbout 15Watt
Camera22*10 times magnifying; 12V/300mA Horizontal resolution: 480 lines; PAL format
Lens size 40mm*40mm
Size of BGA to be aligned 40mm*40mm
Vacuum pump12V/600mA 0.05Mpa(max)
Camera output signal Video Signal
Weight 22kg

RPC Reflow Soldering Process Camera

Model RPC2005
Power About 15Watt
Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

Main parts of BGA Rework System
1. Infrared heating system

Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.

Dark infrared heating technology with 2-8μm long wave can minimize temperature differences to avoid damages resulted from long dipping, cold soldering and overheating.

2. Heating system of BGA Rework System

Bottom dark infrared ceramic heating plate, 800W power; PCB can be preheated evenly and protected from being distorted and damaged. The top heater uses 720W dark infrared heating tube, heating area can be adjusted according to sizes of BGA. When process is over, vacuum will generate automatically to pick up BGA components and return to original position.

3. Soldering Station of BGA Rework System

Intelligent digital soldering station uses high frequency current heating method. It is easy to clean the soldering pad.

4. Nozzles, clamps of BGA Rework System

Special PCBs or PCBs with sockets, connectors can be fixed by the clamps of different lengths.
The nozzles can be selected as per actual sizes of BGA/CSP.

Operating Diagram

 

 

Features
1. IR2015 Infrared reflow soldering section of BGA rework system
Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
2. PL2015 Precise aligning and placing system of BGA rework system
Visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
3. RPC2015 Reflow Camera of BGA rework system
The melting process of BGA solder ball can be observed from different angles, provides critical information to get accurate and reliable process curve.
4. IRsoft Software of BGA rework system
The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC, can meet the demands of modern electronic industry.

Specifications
IR Infrared Rework System

Model IR2015
General power 2800Watt(max)
Power of bottom heater 500W*4=2000Watt or
400W*4=1600Watt(High Infrared heating tube/ Dark Infrared heater optional)
Power of top heater 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm)
Size of top heater60*60mm
Size of bottom heater 267*280mm
Range of top heater20-60mm(X, Y direction both adjustable)
Vacuum pump 12V/300mA, 0.05Mpa(max)
Top cooling fan 12V/300mA, 15CFM
Laser alignment tube 3V/30mA
Movable motor24V DC/100mA
Movable arm range 93mm
Max PCB size 420mm*500mm
LCD window 65.7*23.5mm 16*2 characters
Communication RS-232C(connect with PC)
Infrared temperature sensor0-300℃(Testing Range)
External K-type sensorOptional

PL Precision Placement System

Model PL2015
Power About 15Watt
Camera 22*10 times magnifying; 12V/300Ma Horizontal resolution: 480 lines; PAL format
Lens size 60mm*60mm
Size of BGA to be aligned 60mm*60mm
Vacuum pump 12V/600mA 0.05Mpa(max)
Camera output signal Video Signal
Weight 22kg

RPC Reflow Soldering Process Camera of BGA rework system

Model RPC2015
PowerAbout 15Watt
Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

Main Parts of BGA Rework System
Infrared heating system of BGA rework system

Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.

Top heater of BGA rework system

The top heater uses 2-8μm long wave infrared heating tube, 720W, heating area can be adjusted according to sizes of BGA, protect adjacent components from being heated. No need of nozzles, save cost.

Bottom heater of BGA rework system

The bottom heater uses 4 sets of dark infrared heating plates, with a large power 1600W. Larger PCBs can be placed and heated evenly, avoid deformation and damage.

Optical lens alignment of BGA rework system

The PL part uses optical lens to align components. Red top light, white bottom light, brightness is adjustable. Light source reflected by lens to ensure BGA solder ball and PCB solder pad in line with each other and even.

The solder ball and pad will show clearly in the monitor through the camera of PL part. By adjusting the X, Y axis fine knob and component control knob, solder ball which displays in red and solder pad which displays in white can overlap completely.

Alignment adjustment of BGA rework system

The most precise alignment can realize by fine adjustment of X, Y, Z angles.
Components aligning knob can make BGA 360° rotating.

PCB fixing of BGA rework system

The flexible PCB supporting rod can fix PCB effectively, absorb the expansion force resulted from heating or cooling, prevent the PCB from distortion.
Special PCB can be fixed by different clamps. The supporting rod can be used for the bottom of large PCB to avoid distortion.

 

 

Features
1. BGA2105 rework system uses excellent heating materials to control the process of BGA soldering and de-soldering process accurately.
2. Large power brushless DC fan, temperature controlled by closed loop sensor and micro computer zero triggering, generate large volume of hot air.
3. Various types of titanium nozzles available, easy replacement.
4. Program can be set to control top and bottom hot air temperature, precise and even.
5. Powerful fan cools bottom heating area rapidly.
6. BsolderingSOFT available, easy operation.

Specifications

General power 3500W(max)
Power supply 220V AC, 50/60Hz
Power of top heater 700Watt
Power of bottom pre-heater 400Watt*4=1600Watt(Infrared heater)
Power of bottom heater 700Watt
Speed of side cooling fan ≤3.5 m3/min
Temperature range(Hot air) 500℃(Max)
Temperature range(Preheating)500℃(Max)
Bottom preheating area 330*360mm
Max PCB size 330*360mm
External K-type sensor 3pcs
Communication RS-232C(connect with PC)
Net weight About 23.5kg
Dimensions 610(L)*580(W)*520(H)mm

Nozzles of BGA rework system

Part numberSize (mm)
N07077*7
N09099*9
N131313*13
N1515 15*15
Part numberSize (mm)Part numberSize (mm)
N181818*18N222222*22
N242424*24N262626*26
N282828*28N303030*30
N323232*32N353535*35
N373737*37N393939*39
N444444*44N494949*49
N525252*52

 

 

Features
1. High automatization, the de-soldering, pick-up and placement of chips can be finished by one button, easy operation.
2. Use large power brushless DC fan, closed loop of sensor and micro-computer zero triggering, can generate large volume of hot air. No need for external air supply, easy operation.
3. Seven temperature areas, suitable for reflex BGA, multilayer BGA and metal shielding case.
4. Integrative design, combines heating system and alignment system together.
5. Visible double-colors optical lens alignment, controlled by rocker, clear and precise.
6. Large power fan, speed adjustable, cool bottom heating area quickly.
7. BsolderingSOFT interface, with operation right limitation and profile analysis function available. Can analyze preheating speed, peak temperature, temperature preserving time and cooling rate effectively.
8. Various types of titanium alloy hot air nozzles available, easy replacement.

Specifications

Power supply 220V AC, 50Hz, 5KW
Max PCB size 600*500mm
Min IC size 2*2mm
Max IC size 60*60mm
Size of bottom heater 550*450mm
LCD window 100*75mm 16*2 characters
Mounting Accuracy ±0.025mm
Hot air temperature 500℃(Max)
Bottom preheating temperature 500℃(Max)
Power of top heater 800Watt
Power of bottom heater 800Watt
Power of bottom infrared pre-heater 3200Watt
Speed of side cooling fan ≤ 3.5m3 /min
Camera 12V/300mA 22*10 times magnifying Horizontal resolution: 480 lines PAL format
Outside K-type sensor 5 pcs
Communication RS-232C(connect with PC)
Dimensions 1150(L)*800(W)*800(H)mm
Weight About 120kg

Main Parts of BGA Rework System
Heating System of BGA rework system

800W hot air power for top and bottom heaters, airflow is stepless. The temperature of main heating area can rise quickly. Heat distributes evenly, decrease the vertical temperature difference between chip surface and soldering joint, shorten the whole process.

Main heater of BGA rework system: top hot air bottom hot air

Seven temperature areas, air volume, temperature and heating time of both top and bottom heaters can be adjusted as per requirements. Accurate temperature and even heat distribution can ensure the precision and flexibility of the process.

External 5 K-type sensors, can monitor temperature of PCB and BGA accurately.

Pick-up chips of BGA rework system

Vacuum will generate automatically and pick up BGA chips when the process is finished, then the vacuum will return to original position.

 

Features
1. BGA rework system can ensure even heat distribution and right peak temperature and realize reliable lead-free soldering. Uses closed loop sensor and hot air top heater, sectional hot air for BGA, infrared heating part for complete PCB to prevent PCB from being deformation.
2. 60*60MM optical alignment lens, alignment of large BGA can still show clearly. Align glass is controlled by motor, and small plate for chips is placed above the glass. Special supporting rods can be placed in frame structure of PCB. The bottom supporting rods of BGA rework system are connected with landscape orientation rods to make sure accordance when place PCB. Fine adjustment of X, Y, Z, θ controlled by rocker, linear precision orbit and precision silk pole. Uses motor to control rough and fine adjustment.
3. Except using manual fine adjustment of X, Y, θ in chip fine alignment, Bsoldering BGA2120 can automatically control the pick-up, placement and de-soldering of chips, movement of glass and heater, reflow control etc. which is unique in lead-fee rework systems.

Specifications

General power2200W(max)
Power supply220V/230V AC, 50/60HZ
Top heating power700W
Bottom heating power700W
Bottom preheating power800W
Air speed of side cooling fan≤3.5m3/min
Hot air temperature500℃(MAX)
Hot air temperature range500℃(MAX)
Bottom preheating size300*300mm
Max PCB size300*300mm
Chip size2*2-60*60mm
Placement precision±0.025mm
Camera12V/300mA 22*10 times magnifying; Horizontal resolution: 480lines PAL format
LED LightBottom white LED and top red LED(brightness adjustable)
LCD window100*75(mm) 16*2 characters
CommunicationRS-232C(Connect with PC)
Vacuum12V/300mA, 0.05Mpa(MAX)
External K type sensor5PCS
Net weight50kg
Dimension of BGA rework system600(L)*600(W)*500(H)mm

 

 

 

 

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