Simple BGA Rework System

Simple BGA Rework System

 

 

, Bsoldering855PG Bsoldering855T PCB Fixture

Features
Bsoldering855PG
1. Only 10s needed to desolder IC.
2. Password can be set to protect menu from inadvertent changes.
3. Key-lock function can protect parameters from inadvertent changes.
4. Excellent desoldering efficiency and speed. The whole process includes six programming phases, in which process parameters can be set according to various requirements.
5. 10 program channels available.
6. With vacuum suction pen, easy to use.
7. Large LCD display shows temperature, air volume, working time, etc.
8. Digital temperature calibration, easy and convenient.
9. Magnetic switch and pedal switch available makes our units easy to use.
10. Accurate temperature. Closed-loop temperature control ensures temperature stability up to ±2℃.
11. Auto sleeping, energy-efficient. Auto cooling function can prolong the lifetime of the heating element and protect the unit.
12. Working time can be set within a range of 1-999s.

Bsoldering855T
1. Infrared ceramic heater, rapid heating, high efficiency, long lifetime.
2. Temperature controlled by K type thermocouple, closed loop with zero voltage heater switching, digital display, easy operation.
3. Can be used with Bsoldering855PG for maintenance of SMD and BGA.
4. The arm of Simple BGA Rework System can move easily and conveniently, easy operation.
5. Parts that need preheating can be placed on the stainless steel or fixture (assembled in addition).
6. Two switches are used to control power and heating separately. The temperature of the plate can also be read even in no heating status.
7. Built-in thermometer. Temperature of PCB can be easily tested.
8. Can control external cooling fan.

Specifications

Bsoldering855PG

Rated output 1300W
Temperature range 100℃-500℃
Air volume From 6-200 class; Can set freely
Program phase Six phases
Vacuum suction force 0.03MP
Temperature stability ±2℃
Channel quantity Ten
Anti-static ESD Safe by design

Bsoldering855T

Heating power800W
Plate area 135*250mm
Material of heaterCeramic
Temperature sensorK type Thermocouple
Temperature range50℃-350℃
Temperature stability±1℃
Ambient temperature 0℃-40℃
Measurement range of thermocoupleRoom temperature-600℃
Accuracy±8℃

 

, NOTEBOOK I760

Features
1. Open-type dark infrared heating, non-contact infrared temperature sensor monitoring the surface temperature changes of BGA, closed-loop control, precise temperature technical window and even heat distribution.
2. Large area of bottom infrared heating, preventing PCB from deformation.
3. Vacuum will generate when the process is finished. Rework system can pick up BGA components automatically.

Specifications

Power2400W (max)
Bottom Preheating Power400W*4=1600W (Infrared ceramic plate)
Top Heating Power720W (Infrared heating tube, wave 2~8µm, size: 60*60mm)
Preheating Area of Bottom Heater260*260mm
Rang of Top Heater Area20~60mm
Heating Time of Top HeaterAround10s (Room temperature~230℃)
Vacuum Pump12V/300mA, 0.05Mpa
External Cooling Fan ModeBsoldering855F
CommunicationStandard RS-232C (Connect with PC)
External Keyboard8 buttons (CAL)
Motor24VDC/100mA
Arm Range (up and down)93mm
Infrared Temperature Sensor0~300℃ (Measurement range)
Dimensions330(L)×380(W)×440(H)mm
Weight20Kg

Note: Please mark the working voltage when place order.

 

, NOTEBOOK I760E

Features
1. Open-type dark infrared heating, non-contact infrared temperature sensor, monitoring the surface temperature changes of BGA, closed-loop control, precise temperature technical window and even heat distribution.
2. Large area of bottom infrared heating, preventing PCB from deformation.

Specifications

Power2400W (max)
Bottom preheating power400W*4=1600W (Infrared ceramic plate)
Top heating power720W (Infrared heating tube, wave 2~8µm, size: 60*60mm)
Preheating area of bottom heater260*260mm
Range of top heater area20~60mm
Heating time of top heatingAround10s (Room temperature~230℃)
Vacuum pump12V/300mA, 0.05Mpa
External cooling fan modeBsoldering855F
CommunicationStandard RS-232C (Connect with PC)
External keyboard8 buttons (CAL)
Motor24VDC/100mA
Arm range(up and down)93mm
Infrared temperature sensor0~300℃ (Measurement range)
Dimensions330(L)×380(W)×440(H)mm
Weight20Kg
Standard Moveable FixtureI760

 

 

, NOTEBOOK I760B

Specifications

Max power 2200Watt(max)
Bottom preheating power1500Watt(Infrared heating tube)
Top heating power720Watt(Infrared heating tube, Size: 60m*60 mm)
Preheating area of bottom heater260*260mm
Rang of top heater 20~60mm
Heating time of top heaterApprox 10s ( From room temperature to 230℃)
LCD display screenSize: 65.7*23.5 (mm) 16*2 character
CommunicationStandard RS-232C (Connect with PC)
Infrared temperature sensor0~300℃ (Testing range)
Outside K type sensorOptional
Dimension 33*38*44 (cm)
Weight 20Kg

Note: Please mark the working voltage when placing an order.

 

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